GD75232

GD75232

Category: Available (Qty:9999999)
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Description

BUY GD75232 https://www.utsource.net/itm/p/12359739.html

Parameter Description Min Typ Max Unit
VCC Supply Voltage 4.5 5.0 5.5 V
IOL Output Low Current -16 -8 0 mA
IOH Output High Current 0 4 8 mA
VOL Output Low Voltage 0 0.4 0.8 V
VOH Output High Voltage 4.2 4.4 5.0 V
VIL Input Low Voltage 0 0.8 1.5 V
VIH Input High Voltage 3.0 3.5 5.0 V
ICC Supply Current (per channel) 0 0.1 1.0 mA
tPLH Propagation Delay Time (Low to High) 5 10 15 ns
tPHL Propagation Delay Time (High to Low) 5 10 15 ns
tPD Propagation Delay Time (Average) 5 10 15 ns
tSKEW Skew (Maximum Difference in tPLH and tPHL) 0 2 5 ns

Instructions for Using GD75232:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Output Current (IOL, IOH):

    • The output low current (IOL) should not exceed -16mA.
    • The output high current (IOH) should not exceed 8mA.
  3. Output Voltage (VOL, VOH):

    • The output low voltage (VOL) should be between 0V and 0.8V.
    • The output high voltage (VOH) should be between 4.2V and 5.0V.
  4. Input Voltage (VIL, VIH):

    • The input low voltage (VIL) should be between 0V and 1.5V.
    • The input high voltage (VIH) should be between 3.0V and 5.0V.
  5. Supply Current (ICC):

    • The supply current per channel should be between 0mA and 1.0mA.
  6. Propagation Delay (tPLH, tPHL, tPD):

    • The propagation delay time from low to high (tPLH) and from high to low (tPHL) should be between 5ns and 15ns.
    • The average propagation delay time (tPD) should also be between 5ns and 15ns.
  7. Skew (tSKEW):

    • The maximum difference in propagation delay times (tSKEW) should not exceed 5ns.
  8. Handling and Storage:

    • Handle the device with care to avoid static discharge and physical damage.
    • Store the device in a dry, cool place away from direct sunlight and corrosive materials.
  9. Mounting and Soldering:

    • Use appropriate soldering techniques and temperatures to avoid damaging the device.
    • Ensure proper alignment and secure mounting on the PCB.
  10. Testing:

    • Test the device under specified operating conditions to ensure it meets the required performance parameters.
(For reference only)

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