Hybrid Bonding - DB-22H Ultra

Hybrid Bonding - DB-22H Ultra

• Continuous IC delivery reduces waiting time and boosts output.
• High placement accuracy: ±0.03mm
• One test head per station for faster changeovers.
• Up to 8 test stations.
• Multi-angle vision system (Top, Bottom, 5S, Tapping)
• Servo-driven Z-axis, independent per station.
• Disk alignment and vacuum rotation for smooth handling.
• Automatic in-pocket anomaly detection.