IBM-ER3042 is a two-component epoxy adhesive designed for bonding and sealing electronic components. It provides excellent electrical insulation, heat resistance, moisture resistance, and chemical resistance. The cured product exhibits outstanding mechanical properties and strong adhesion to various substrates, while being environmentally friendly and pollution-free.
| Property | Unit | Value |
| Density @25 °C | g/cm³ | 1.1 |
| Mixed Viscosity @25 °C | mPa·s | ≤ 3000 |
| Working Time @25 °C | min | ≥ 20 |
| Tack-free Time @25 °C | h | ≤ 4 |
| Full Cure Time @25 °C | h | ≤ 36 |
| Light Transmittance (2 mm thick) | % | ≥ 90 |
| Tensile Strength | MPa | ≥ 50 |
| Shear Strength | MPa | ≥ 50 |
| Hardness (Shore D) | Shore D | 60–70 |
| Elongation | % | 2 |
| Initial Adhesion (SUS) | MPa | ≥ 10 |
| 85 °C / 85 % RH, 168 h | No change | |
| Thermal Shock −20 °C / 100 °C, 100 cycles | No change |
Electronics: Bonding and sealing electronic components, potting, insulation, and moisture protection.
Manufacturing: Fixing metal, plastic, ceramics, glass, composite materials, and structural parts.
Automotive & Machinery: Repairing cracks, filling gaps, reinforcing parts, and ensuring vibration resistance.
Household Use: DIY repairs, bonding household items, and general maintenance.
Handicrafts: Craft bonding, model making, and handmade projects requiring strong adhesion.
Lihat detail lebih lanjut tentang Solcrest (JB) Sdn. Bhd.
Malaysia
