MEC - ISS24T1/03/RH 24 PIN IC SOCKET

MOBICON-REMOTE ELECTRONIC SDN BHD

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IC SOCKET SLIM 24P <ISS24T1/03/RH> XPB

IC Socket Stamped Pin Pitch 2.54mm, 24 Pins

Row to Row 7.62mm, Dip Solder Type

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MOBICON-REMOTE ELECTRONIC SDN BHD Electronic Components Selangor, Penang, Test & Measurement Instruments Supply Kuala Lumpur (KL), Automation Parts Supplier Malaysia ~ MOBICON-REMOTE ELECTRONIC SDN BHD

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