Are manual loading processes creating a bottleneck in your semiconductor packaging line?
The Yamato Automatic Packaging and Curing Furnace is a fully customized inline solution designed to match your exact production rhythm.
Engineered for advanced semiconductor packaging, this system handles resin curing, silicone curing, silver paste curing, and pressure-less silver sintering.
By configuring automatic feeding and loading, you can achieve true, uninterrupted automated production.
⚙️ Key Specifications:
• Inline Automation: Upper and lower chambers feature automatic doors for seamless integration with your production line.
• Ultimate Purity: Configurable for Class 100 Cleanliness and ultra-low O2 concentration (20ppm) if your process requires it.
• Precision Heating: Operating temperature range of 40°C to 300°C with a strict deviation of just ±5°C.
• Independent Control: Dual chambers operate independently to save installation space while utilizing rapid water cooling.
Malaysia
