Yamato 6-Chamber Semiconductor Curing Oven

Cleanroom floor space is one of the most expensive assets in a semiconductor facility. The Yamato 6-Chamber Curing Oven is designed to maximize your End of Line (EOL) packaging throughput while drastically reducing your equipment footprint.

Engineered for resin curing during semiconductor packaging, this customized system stacks 6 independently operated chambers into one highly efficient unit.

🏭 Key Specifications:
• Space-Saving Design: 6-chamber combination allows for massive multi-batch processing in a single vertical footprint.
• Independent Control: Each chamber operates autonomously with rapid temperature rise and fall capabilities.
• Precision Curing: Temperature range of 40°C to 260°C, with an actual sample surface temperature accuracy of ±5°C (at 175°C).
• Inert Gas Protection: Fully equipped to prevent oxidation during the curing phase.

Maximize your cleanroom efficiency with Renetech. 
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