Yamato Plating Annealing High Temp. Oven

Tin whisker growth is a massive liability in electronic packaging, leading to catastrophic product pin short circuits. The Yamato Plating Annealing Oven is specifically designed to eliminate this risk in electroplated semiconductor components.
By baking electroplated products at highly stable high temperatures (typically 175°C for 2 hours), this custom oven relieves internal stress and permanently neutralizes the potential for whisker growth.

⚙️ Key Specifications:
• Maximum Temperature: 260°C.
• High Precision: Maintains a strict temperature deviation of just ±5°C to ensure uniform annealing across the entire batch.
• Customizable: Fully adaptable to your packaging line's specific footprint and throughput requirements.
Eliminate short-circuit liabilities in your packaging facility. 

Reach out to Renetech for expert Yamato industrial integration in Malaysia!