Yamato 5-Layer Vacuum Curing Oven (Chip Packaging)

Standard curing ovens cannot eliminate the trapped air and moisture that cause defects during chip packaging. 

The Yamato Vacuum Curing Oven is a customized industrial solution engineered specifically for high-temperature vacuum curing in semiconductor facilities.
Featuring a fully automated process cycle—from vacuumizing and heating to N2 injection and cooling—this system guarantees defect-free curing without requiring constant operator supervision.

🏭 Key Specifications:
• High-Capacity Heating: Equipped with 5-layer shelf heating for maximum batch processing.
• Deep Vacuum: Achieves a vacuum degree of less than 100 Pa, monitored precisely by a digital Pirani vacuum gauge.
• High Temperature: Maximum working temperature of 250°C.
• Perfect Uniformity: Delivers an incredibly tight temperature uniformity of ±5°C directly on the shelf surface under vacuum conditions.

Protect your chip packaging yields. 
Contact Renetech Malaysia today