Yamato High Temperature Pressure Defoaming Machine

Are trapped air bubbles and voids compromising the integrity of your electronic component adhesives? The Yamato High-Temperature Pressure Defoaming Machine is a custom industrial solution designed specifically for the flawless defoaming and drying of critical adhesives.

Engineered with advanced touch screen and PLC controls, this system allows you to execute perfect linear temperature and pressure rising processes to ensure absolutely void-free curing.

⚙️ Key Specifications:
• Operating Range: Precise temperature control from Room Temp. +20°C up to 200°C.
• High Pressure: Capable of a maximum operating pressure of 0.85 MPa.
• Process Control: Features linear pressure increasing and decreasing to protect delicate components.
• Rapid Turnaround: Integrated rapid water cooling significantly reduces batch times.

Eliminate adhesive defects in your electronics manufacturing line. 

Message Renetech on WhatsApp today to discuss custom Yamato defoaming integration!