Description
Details
Highlights
- One-component moisture-curing urethane adhesive designed for plastic bonding applications
- Hot-applied (warm application) for improved flow and controlled dispensing
- Low viscosity formulation enables thin, precise bond lines when used with suitable equipment
- Long open time allows adequate positioning and assembly flexibility
- Provides strong, flexible bond lines that improve durability, fit, and appearance
- Bonds a wide range of substrates including plastics, metals, and dissimilar materials
- Effective on difficult plastics such as polycarbonate and other engineering plastics
- Helps improve aesthetics by avoiding cyanoacrylate whitening and ultrasonic welding cracking
- Suitable for consumer electronics and precision assembly applications
Description
The 3M™ Plastic Bonding Adhesive 2665B (7100111531) is a one-component, moisture-curing urethane adhesive designed for high-performance plastic bonding. It is applied in a warm state, allowing controlled flow and thin bond lines when used with appropriate dispensing equipment. The adhesive provides strong, flexible bonds across a variety of substrates including plastics, metals, and difficult-to-bond materials such as polycarbonate. Its long open time supports assembly alignment, while the cured bond improves durability, appearance, and reliability. Supplied in 30 cc syringes (24 per case), it is widely used in electronics and precision manufacturing where high-quality cosmetic and structural performance is required.
Typical Properties
| Property |
Value |
| Brand |
3M™ |
| Product Type |
Plastic Bonding Adhesive |
| Model |
2665B |
| Article Number |
7100111531 |
| Colour |
Black |
| Chemistry |
Moisture-curing urethane |
| Application Method |
Warm / hot applied (syringe dispensing) |
| Viscosity |
Low |
| Open Time |
Long |
| Substrates |
Plastics, metals, dissimilar materials |
| Special Capability |
Bonds polycarbonate & engineering plastics |
| Packaging |
30 cc syringe (24 per case) |
| Application |
Electronics, plastic assembly, precision bonding |
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