Description
FEATURES:
● Employs a single-point temperature control system, allowing independent temperature control for each solder joint;
● The position of each solder joint can be independently adjusted (front, back, left, right, top, and bottom);
● Equipped with a fan power system for rapid cooling and molding, improving production efficiency;
● The equipment features a temperature offset monitoring mode for more accurate solder joint temperature control.
More detail about AH Engineering Sdn Bhd
Malaysia
