MAXstream® Remote Plasma Source:
Cooling: Water
Output Frequency (MHz, kHz): 400 kHz
Input Voltage (V): 208 VAC
Power Level (kW): 6 to 12 kW
Rack Width: N/A, chamber mounted
Communications Interface: RS-232, Analog, Ethernet, EtherCAT
Process Applications: Chamber Clean, Reactive Etch, Reactive Deposition
Chemical Compatibility: Ar, O2, H2, N2, F2, H2O, NF3, CxFy
Flow Range: 12
Description
Reliable, High-Performance Remote Plasma Source for Chamber Clean Applications The MAXstream RPS is available in multiple SLPM NF3 flow rates to optimize price and performance. It ensures long chamber life and low particle generation, and a unique dual ignition core design delivers best-in-class plasma ignition reliability.
.Key Features
MAXstream 300 (≤ 3 L) for low flow applications and MAXstream 1200 (≤ 12 L) for higher flow applications
Highly reliable RPS maximizes tool uptime
Enhanced cooling of plasma source walls to reduce damage from thermal expansion and chemical erosion
Active monitoring and control of plasma power for advanced power control
Benefits
Optimize cost via multiple flow options
Save valuable tool space with a smaller footprint than Xstream RPS
Extremely reliable ignition with unique AE dual ignition cores
Increase chamber life with proprietary AE chamber design
Reduce cleaning time with up to 12 SLPM flow capabilities
