Rapid Ox Remote Plasma Source:
Cooling: Hybrid (air and water)
Output Frequency (MHz, kHz): 400 kHz
Input Voltage (V): 208 VAC
Power Level (kW): 6 kW
Rack Width: N/A, chamber mounted
Communications Interface: RS-232, Analog, Ethernet
Process Applications: Chamber Clean
Chemical Compatibility: O2, N2
Flow Range: 4
Description
Ideal Remote Plasma Source for Oxygen-Based Processes Reduce recombination effects and extend the lifetime of oxygen radicals thanks to Rapid OX's removable quartz liner. When compared to anodized chambers, the resultant reactive species extended lifetime improves photoresist strip rates. And because the quartz liner is easily installed or removed by the operator, it decreases downtime and significantly lowers replacement costs
Key Features
Quartz liner makes it ideal for photoresist ashing or carbon chamber clean processes
Variable frequency matching provides a range of plasma impedance operation, controlled by varying gas chemistry, pressure, and power set point
Improved thermal management helps ensure long chamber lifetime
Rapid OX quickly ignites and reaches steady-state operation due to low dynamic pressure overshoot
Benefits
Significantly reduce downtime and cost of ownership via a removable and replaceable quartz chamber
Improve process performance thanks to a high dissociation rate and high-density radical generation
Ensure repeatable, controllable processes with variable frequency tuning and precise power control
Increase the chamber lifetime and reduce service costs thanks to the reliable design and cooling system
Improve tool utilization, reduce preventive maintenance, and lower CoO
