BSM181A

BSM181A

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Parameter Symbol Conditions Min Typ Max Unit
Forward Voltage V_F IF = 20 mA 1.8 2.2 V
Reverse Current I_R VR = 5 V 10 μA
Peak Forward Current I_FM Pulse Width ≤ 1 ms 100 mA
Total Power Dissipation P_T Ta = 25°C 100 mW
Operating Temperature T_op -40 85 °C
Storage Temperature T_stg -40 100 °C

Instructions for BSM181A

  1. Handling: Use caution when handling the device to avoid damage from electrostatic discharge (ESD). Ensure proper grounding.
  2. Mounting: Follow standard surface mount technology (SMT) procedures for mounting. Ensure the correct orientation of the diode during placement.
  3. Soldering: Use a soldering temperature not exceeding 260°C for a maximum duration of 10 seconds per joint. Avoid overheating which can damage the component.
  4. Power Handling: Do not exceed the peak forward current or total power dissipation limits specified in the table to prevent thermal damage.
  5. Environmental Conditions: Operate within the specified temperature ranges to ensure reliable performance and longevity.
  6. Testing: After installation, verify the functionality of the device under typical operating conditions as outlined in the parameter table.
(For reference only)

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