GC ejecting needles are made of BeCu alloy material, whose inherent characteristics include high hardness, strong mechanical strength and a low degree of wear, making them suitable for processing into ejecting needles.
GC ejecting needles are specifically produced by G.C Micro and are mainly used in LED chip sorting and semiconductor IC die bonding processes to prevent push-up damage to the chip bottom side.
Depending on the die dimensions and aspect ratio, the required specifications for tip radius and structure design are adjusted accordingly.