All-in-one 3D ultra-depth digital microscope for observation, imaging, 2D and 3D measurement, stitching, particle analysis, roughness analysis, and high-precision industrial inspection. The DMS Series combines ultra-high precision and large depth-of-field microscopic imaging with a high-resolution 4K imaging unit, intelligent operating system, plan apochromat objective options, motorized nosepiece, high-precision focus Z-axis, and high-precision stage control. It is designed for users who need more than conventional optical microscopy, bringing together observation, photography, measurement, image processing, and digital analysis in one integrated platform. The system delivers large depth of field and high resolution with one-click transition from 2D to 3D measurement. With professional APO optics, multi-illumination observation modes, motorized control, and advanced algorithmic image processing, it supports clear presentation of subtle textures, accurate full-field measurement, and efficient digital inspection across industrial, semiconductor, metallurgical, biological, and forensic applications. Available as flagship and standard configurations, the DMS Series supports a wide range of optics, stages, cameras, and software tools to match specific application scenarios, from compact full-function systems to fully motorized high-resolution 3D digital microscopy platforms. Transforms traditional microscopy into a digital measurement workflow with one-click transition from 2D observation to 3D analysis and height-based inspection. Includes real-time depth fusion, anti-ring reflection removal, HDR, real-time continuous focusing, map navigation, image stitching, and 3D image stitching for clearer and more informative digital microscopy. Supports distance, angle, area, circle, polygon, contour, profile, point height, volume, cross-field measurement, and automatic measurement functions for fast and precise dimensional analysis. Suitable for semiconductors, electronics, metallurgy, automotive paint inspection, biological samples, insects, forensics, glass, mold inspection, camera modules, chips, solder points, and more. Simply place the specimen on the stage and use the controller for positioning, focusing, and magnification changes. The intelligent operating system is built for intuitive observation and fast workflow control, allowing users to complete magnification switching, autofocus, and stage movement directly from the controller. Fast autofocus reveals fine details quickly, while automatic magnification switching enables rapid movement from low to high magnification. The high-precision XY motorized stage offers long travel range with rapid, smooth motion for efficient navigation across the sample. The all-round observation system combines plan apochromat objectives, transmitted light, controller-based positioning, and multi-angle observation for crystal-clear presentation of subtle textures. The stage can incline up to 90° left and right, enabling seamless tilted observation and multi-perspective inspection. One-touch optimal imaging and reflection transformation functions help reveal difficult surface details. The system fuses multi-angle illumination with advanced algorithmic processing so even fine surface topography becomes clearly visible. It supports standard reflection transformation, color transformation, and bump mapping views for enhanced structure interpretation. Automatically performs focus stacking while the stage moves, producing a fully fused depth-of-field image in real time for uneven surfaces and complex samples. Reduces overexposure and loss of detail caused by ring illumination, generating clearer glare-free images from reflective sample surfaces. Reconstructs areas with extreme brightness differences to achieve high-definition, high-contrast observation where standard imaging loses tonal detail. Supports map navigation, image stitching up to 100,000 × 100,000 pixels, and large-scale 3D image stitching for fast access to any area at any magnification. With simple mouse operations, users can perform real-time 2D measurements such as point-to-point, point-to-line, angle, diameter, parallel lines, area, arc length, circles, polygons, and more. Data can be exported to Excel or CSV, and users can customize display parameters such as font size, line color, and units. The DMS Series also provides 3D measurement tools including contour measurement, 3D profile measurement, 3D point height measurement, height mapping, tilt correction, and volume measurement. One-touch tilt correction helps ensure fast and precise contour and height analysis. Fully motorized flagship imaging system with 4K CMOS sensor, larger depth of field, high resolution, and multiple observation modes including Brightfield, Darkfield, Polarization, and DIC. Designed for high-pixel imaging and precise measurement. Highly scalable monocular lens system with broad lens portfolio, high-frame-rate imaging, and smooth true-to-life observation for dynamic processes and diverse inspection tasks. Compact standard model offers efficient observation, high-resolution imaging, precise measurement, greatly extended depth of field, comprehensive viewing, and unified platform design with full core software functionality. The DMS Series supports a comprehensive range of cameras, stands, and optics to create customized solutions for specific application scenarios and working distances. Used for chip observation, chips and gold wires, camera module slices, camera solder pack points, circuit boards, and semiconductor surface inspection. Supports metallographic structure analysis, mold inspection, metal beads, contact point inspection, and glass substrate groove depth measurement. Suitable for document forensics such as handwriting indentation, plus insects, beetles, algae clusters, and fine biological sample observation. Used for automotive paint cross-sections, screws, needles, industrial parts, and general high-precision quality inspection workflows.
DMS Series 3D Ultra-Depth Digital Microscope
Product Overview
DMS Series is an all-in-one imaging, measurement, and analysis system that moves microscopy from 2D to 3D, from observation to measurement, from manual to motorized, and from visual to digital workflows.
Key Specifications
Main Features
From Observation to 3D Measurement
Excellent Image Processing
2D & 3D Measurement Tools
Wide Industry Use
Intelligent Operating System
Observation & Illumination
Clear Presentation of Subtle Texture
Optical Performance
Excellent Image Processing
Real-Time Depth Fusion
Anti-Ring Reflection Removal
HDR Imaging
Navigation & Stitching
Measurement & Analysis
Advanced Analysis Functions
Models & Configurations
Flagship High-Resolution Imager
Standard High-Performance Imager
Standard Compact Model
Tailored Serialization Options
Optics & Stage Options
Objective & Lens Options
Stage Options
Software Functions
Application Examples
Electronics & Semiconductor Inspection
Metallography & Materials
Forensics & Biological Samples
Automotive & Industrial Quality Control
Malaysia
