TLP559(F)

TLP559(F)

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OPTOISOLATOR 2.5KV TRANS 8-DIP

Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage VF - 1.2 1.4 V IF = 10 mA, TA = 25°C
Peak Forward Current IF(PK) - - 100 mA t = 1 s, TA = 25°C
Continuous Forward Current IF - - 30 mA TA = 25°C
Reverse Voltage VR - - 5 V TA = 25°C
Isolation Voltage VI - - 2500 Vrms 1 min, 50/60 Hz
Output Collector-Emitter Saturation Voltage VCE(SAT) 0.2 0.3 0.4 V IC = 5 mA, TA = 25°C
Output Collector Current IC - - 10 mA TA = 25°C
Output Turn-On Time tON - 1 2 μs IF = 10 mA, RL = 1 kΩ, VCC = 5 V, TA = 25°C
Output Turn-Off Time tOFF - 1 2 μs IF = 10 mA, RL = 1 kΩ, VCC = 5 V, TA = 25°C
Storage Temperature Range TSTG -40 - 110 °C -
Operating Temperature Range TA -40 - 85 °C -

Instructions for Use:

  1. Forward Current (IF):

    • Ensure that the forward current through the LED does not exceed 30 mA continuously to avoid damaging the device.
    • For pulse applications, the peak forward current can be up to 100 mA for a duration of 1 second.
  2. Reverse Voltage (VR):

    • The reverse voltage across the LED should not exceed 5 V to prevent breakdown.
  3. Isolation Voltage (VI):

    • The isolation voltage between the input and output sides is rated at 2500 Vrms for 1 minute at 50/60 Hz. This ensures safe operation in high-voltage environments.
  4. Output Collector-Emitter Saturation Voltage (VCE(SAT)):

    • When the output transistor is saturated, the collector-emitter voltage should be kept below 0.4 V to ensure efficient operation.
  5. Output Collector Current (IC):

    • The maximum continuous collector current is 10 mA. Exceeding this value can damage the output transistor.
  6. Turn-On and Turn-Off Times:

    • The typical turn-on and turn-off times are 1 μs each, with a maximum of 2 μs. These values are crucial for timing considerations in your circuit design.
  7. Temperature Ranges:

    • The operating temperature range is from -40°C to 85°C, and the storage temperature range is from -40°C to 110°C. Ensure that the device is used within these limits to avoid performance degradation or failure.
  8. Handling Precautions:

    • Handle the TLP559(F) with care to avoid static discharge, which can damage the sensitive components.
    • Use appropriate heat sinks if the device will be operated at higher currents or temperatures to ensure reliable operation.
  9. Mounting:

    • Follow the recommended PCB layout guidelines to ensure proper thermal management and electrical performance.
    • Ensure that the leads are soldered correctly and that the device is securely mounted to the PCB.
  10. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications and performs reliably.
(For reference only)

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