详情
Hybrid Bonding - DB-22H Ultra
- Continuous IC delivery reduces waiting time and boosts output.
- High placement accuracy: ±0.03mm
- One test head per station for faster changeovers.
- Up to 8 test stations.
- Multi-angle vision system (Top, Bottom, 5S, Tapping)
- Servo-driven Z-axis, independent per station.
- Disk alignment and vacuum rotation for smooth handling.
- Automatic in-pocket anomaly detection.
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Malaysia
