74 series Digital Integrated Circuits
SI7431DP-T1-GE3
SI7431DP-T1-GE3

 

SI7431DP-T1-GE3

Utsource Holding Company Limited flag
Category: 74 series Digital Integrated Circuits Available (Qty:9999999)
For more information, visit our official website at utsource.us
Visit Official Site Contact Us
Description

BUY SI7431DP-T1-GE3 https://www.utsource.net/itm/p/11772660.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VDD Operating 1.65 3.3 5.5 V
Quiescent Current IQ VDD = 3.3V - 0.1 1 μA
Input Voltage Range VI 0 - VDD V
Output Voltage (High) VOH IO = -1mA 2.4 - VDD-0.1 V
Output Voltage (Low) VOL IO = 16mA 0 - 0.4 V
Output Current (Sink) IOS VOL = 0.4V 16 - 20 mA
Output Current (Source) IOS VOH = VDD-0.1V -1 - -16 mA
Propagation Delay Time tpd VDD = 5V, tr/tf = 10ns/10ns - 25 - ns
Power Dissipation PD Continuous - - 660 mW
Operating Temperature Range TA Storage -40 - 85 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 1.65V to 5.5V.
    • Connect the power supply to the VDD pin and ground to the GND pin.

  2. Input Signals:

    • The input voltage (VI) should be between 0V and VDD.
    • Ensure that the input signals do not exceed the supply voltage to avoid damage.

  3. Output Signals:

    • The output voltage (VOH) when high should be at least 2.4V and can go up to VDD - 0.1V.
    • The output voltage (VOL) when low should be no more than 0.4V.
    • The output can sink up to 20mA and source up to -16mA.

  4. Propagation Delay:

    • The propagation delay time (tpd) is typically 25ns under standard conditions (VDD = 5V, tr/tf = 10ns/10ns).

  5. Thermal Considerations:

    • The maximum power dissipation (PD) is 660mW. Ensure proper heat dissipation if operating near this limit.
    • The operating temperature range (TA) is from -40°C to 85°C. Avoid operating outside this range to prevent damage or reduced performance.

  6. Storage and Handling:

    • Store the device in a dry, cool place.
    • Handle with care to avoid static discharge, which can damage the device.

  7. Mounting:

    • Solder the device to the PCB using appropriate soldering techniques and temperatures to avoid thermal stress.
    • Ensure good mechanical and electrical connections to all pins.

  8. Testing:

    • After mounting, test the device to ensure it meets the specified parameters.
    • Use a multimeter to check the supply voltage and output voltages.

By following these guidelines, you can ensure optimal performance and reliability of the SI7431DP-T1-GE3.

(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited
Contact Us flag