SN74LS259N: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	V_CC	4.75	5.0	5.25	V	Over full operating temperature range
Input Low Voltage	V_IL	0.0	0.8	-	V	V_CC = 5V, I_L = 1.6 mA
Input High Voltage	V_IH	2.0	-	5.0	V	V_CC = 5V, I_H = 40 μA
Output Low Voltage	V_OL	0.0	0.4	0.5	V	V_CC = 5V, I_L = 16 mA
Output High Voltage	V_OH	2.7	3.5	5.0	V	V_CC = 5V, I_H = -400 μA
Propagation Delay Time	t_pd	22	-	34	ns	V_CC = 5V, T_A = 25°C, typical load
Power Dissipation	P_D	-	-	500	mW	Maximum power dissipation per package
Operating Temperature Range	T_A	-55	-	125	°C	Commercial: 0°C to 70°C, Industrial: -40°C to 85°C, Military: -55°C to 125°C
Storage Temperature Range	T_STG	-65	-	150	°C	Storage and soldering temperatures

Power Supply:
- Connect the V_CC pin to a 5V supply.
- Ground the GND pin.
Address Inputs:
- Apply binary address inputs (A0-A7) to select one of the 8 output lines (Y0-Y7).
Chip Enable (CE):
- Set CE low to enable the device. If CE is high, all outputs are high impedance.
Output Enable (OE):
- Set OE low to enable the selected output. If OE is high, all outputs are high impedance.
Data Input (D):
- Connect the data input pin (D) to the desired logic level to be transferred to the selected output.
Propagation Delay:
- Ensure that the propagation delay time (t_pd) is considered when designing the timing of your circuit.
Temperature Considerations:
- Operate within the specified temperature ranges to ensure reliable performance.
Power Dissipation:
- Do not exceed the maximum power dissipation limit to avoid damaging the device.
Storage and Handling:
- Store and handle the device within the specified storage temperature range to prevent damage.
Soldering:
- Follow standard soldering practices and temperature guidelines to avoid thermal damage during assembly.

(For reference only)