HCPL-2631-000E

HCPL-2631-000E

Category: Available (Qty:9999999)
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Description

BUY HCPL-2631-000E https://www.utsource.net/itm/p/842817.html
HIGH SPEED-10 MBit/s LOGIC GATE OPTOCOUPLERS

Parameter Symbol Conditions Min Typ Max Unit
Forward Voltage VF IF = 20 mA 1.1 1.3 1.5 V
Reverse Breakdown Voltage VR(R) IR = 10 μA - 500 - V
Forward Current IF Continuous - 50 - mA
Peak Forward Current IF(SM) 10% Duty Cycle, 100 μs Pulse Width - 150 - mA
Reverse Current IR VR = 500 V - 10 - μA
Isolation Voltage VIORM 1 Minute, 50/60 Hz - 2500 - Vrms
Propagation Delay Time tPLH, tPHL VO = 5 V, RL = 1 kΩ, IF = 20 mA - 3.5 - μs
Rise Time tr VO = 5 V, RL = 1 kΩ, IF = 20 mA - 0.9 - μs
Fall Time tf VO = 5 V, RL = 1 kΩ, IF = 20 mA - 0.9 - μs
Storage Temperature Range TSTG - -40 - 125 °C
Operating Temperature Range TA - -40 - 105 °C

Instructions for Use:

  1. Forward Current (IF):

    • Ensure that the forward current does not exceed 50 mA continuously.
    • For peak applications, do not exceed 150 mA with a 10% duty cycle and 100 μs pulse width.
  2. Reverse Voltage (VR(R)):

    • The reverse breakdown voltage is specified at 500 V with a reverse current of 10 μA. Ensure that the reverse voltage does not exceed this value to avoid damage.
  3. Isolation Voltage (VIORM):

    • The device can withstand an isolation voltage of up to 2500 Vrms for 1 minute at 50/60 Hz. This is crucial for ensuring safe operation in high-voltage applications.
  4. Propagation Delay (tPLH, tPHL):

    • The propagation delay time is typically 3.5 μs under standard conditions. This is important for timing considerations in your circuit design.
  5. Rise and Fall Times (tr, tf):

    • The rise and fall times are both typically 0.9 μs. These values help in understanding the switching characteristics of the device.
  6. Temperature Ranges:

    • The storage temperature range is from -40°C to 125°C.
    • The operating temperature range is from -40°C to 105°C. Ensure that the device operates within these limits to avoid thermal stress and potential failure.
  7. Handling and Storage:

    • Store the device in a dry, cool place away from direct sunlight and sources of heat.
    • Handle the device with care to avoid mechanical damage and static discharge.
  8. Mounting:

    • Follow the recommended PCB layout and soldering guidelines provided by the manufacturer to ensure reliable performance and prevent thermal issues.
  9. Testing:

    • Before integrating the device into your final application, perform thorough testing under various conditions to ensure it meets your specifications.
  10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your specific application.
(For reference only)

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