TLP3561

TLP3561

Category: Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY TLP3561 https://www.utsource.net/itm/p/817821.html
PHOTOCOUPLER GaAs LED + PHOTO-TRIAC + TRIAC

Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage VF - 1.2 1.5 V IF = 20 mA, TA = 25°C
Reverse Breakdown Voltage VBR 5 - 7 V IR = 1 mA, TA = 25°C
Output High Voltage VOH 2.4 3.5 4.5 V IOH = -4 mA, VDD = 5 V, TA = 25°C
Output Low Voltage VOL 0 0.4 0.8 V IOL = 16 mA, VSS = 0 V, TA = 25°C
Input Current IF 1 20 50 mA VF = 1.5 V, TA = 25°C
Propagation Delay Time tPLH, tPHL - 10 20 ns VDD = 5 V, TA = 25°C, IF = 20 mA, RL = 500 Ω
Storage Temperature TSTG -40 - 105 °C -
Operating Temperature TA -40 - 85 °C -

Instructions for Use:

  1. Power Supply:

    • Ensure the power supply voltage (VDD) is within the specified range to avoid damage to the device.
    • Typical operating voltage is 5 V.
  2. Input Current:

    • The input current (IF) should be within the specified range to ensure proper operation.
    • A typical value is 20 mA.
  3. Output Load:

    • Connect the load resistor (RL) appropriately to match the output current requirements.
    • Ensure the load resistance is not too low to prevent excessive current draw.
  4. Temperature Considerations:

    • Operate the device within the specified temperature ranges to avoid thermal stress.
    • The storage temperature range is -40°C to 105°C, and the operating temperature range is -40°C to 85°C.
  5. Propagation Delay:

    • Account for the propagation delay time (tPLH, tPHL) in your timing calculations to ensure accurate signal transmission.
    • Typical values are around 10 ns with a maximum of 20 ns.
  6. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Use appropriate ESD protection measures during handling and installation.
  7. Mounting:

    • Follow recommended PCB layout guidelines to ensure optimal performance and reliability.
    • Ensure proper soldering and mounting techniques to avoid mechanical stress on the device.
(For reference only)

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