BCM43236BKMLG

BCM43236BKMLG

Category: Available (Qty:9999999)
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Description

BUY BCM43236BKMLG https://www.utsource.net/itm/p/11728739.html

Parameter Description Value
Part Number Product Identifier BCM43236BKMLG
Package Type Package Style BGA (Ball Grid Array)
Package Size Package Dimensions 5.0 x 5.0 x 1.0 mm
Operating Temperature Range of temperatures where the device can operate safely -40°C to +85°C
Storage Temperature Range of temperatures where the device can be stored without damage -40°C to +150°C
Supply Voltage (VCC) Recommended operating voltage range 2.7 V to 3.6 V
Operating Frequency Frequency range for optimal performance 2.4 GHz to 2.5 GHz (2.4 GHz Band)
Data Rate Maximum data rate supported Up to 300 Mbps
Interface Communication interface types SDIO, PCIe, USB 2.0
Antenna Type Type of antenna used External or Internal
Certifications Compliance with industry standards FCC, CE, IC, ETSI
Features Key features of the component 802.11a/b/g/n, Bluetooth 4.0
Pin Count Number of pins on the package 64
ESD Protection Electrostatic discharge protection level ±2 kV (HBM)
RoHS Compliance Compliance with Restriction of Hazardous Substances Directive Yes

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the recommended range of 2.7 V to 3.6 V.
    • Use a stable power source to avoid voltage fluctuations.
  2. Temperature Management:

    • Operate the device within the specified temperature range (-40°C to +85°C).
    • Ensure proper heat dissipation by using heatsinks or thermal pads if necessary.
  3. Antenna Connection:

    • Connect the appropriate antenna type (external or internal) as per your application requirements.
    • Ensure the antenna is properly matched and positioned for optimal performance.
  4. Interface Configuration:

    • Choose the appropriate communication interface (SDIO, PCIe, USB 2.0) based on your system design.
    • Follow the specific interface protocol and pinout configuration.
  5. Firmware and Drivers:

    • Install the latest firmware and drivers provided by Broadcom to ensure compatibility and performance.
    • Refer to the datasheet and user manual for detailed firmware update procedures.
  6. Electrostatic Discharge (ESD) Precautions:

    • Handle the component with care to avoid ESD damage.
    • Use ESD protective equipment such as wrist straps and mats when handling the component.
  7. Storage:

    • Store the component in a dry, cool place within the storage temperature range (-40°C to +150°C).
    • Keep the component in its original packaging until ready for use to protect against moisture and static.
  8. Regulatory Compliance:

    • Ensure that the final product complies with all relevant regulatory standards (FCC, CE, IC, ETSI) before deployment.
  9. Testing:

    • Perform thorough testing of the component in your application to verify performance and reliability.
    • Use diagnostic tools and software provided by Broadcom for troubleshooting and validation.

For more detailed information, refer to the BCM43236BKMLG datasheet and application notes available from Broadcom.

(For reference only)

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