W9864G2GH-6

W9864G2GH-6

Category: Available (Qty:9999999)
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Description

BUY W9864G2GH-6 https://www.utsource.net/itm/p/11728654.html

Parameter Description Value
Device Type High-Density NAND Flash Memory -
Memory Size Storage Capacity 64 GB
Package Type Package Style BGA
Form Factor Ball Grid Array (BGA) 169-Ball
Ball Pitch Distance Between Balls 0.8 mm
Operating Voltage Supply Voltage (Vcc) 1.8 V ± 0.1 V
Interface Data Interface Toggle Mode 2.0
Data Rate Maximum Data Transfer Rate 400 MB/s
Operating Temperature Temperature Range for Normal Operation -40°C to +85°C
Storage Temperature Temperature Range for Storage -55°C to +125°C
Endurance Program/Erase Cycles Up to 3,000
Retention Data Retention Time 10 years at 25°C
ECC Requirement Error Correction Code Requirement Up to 24 bits/512 B

Instructions for Use

  1. Power Supply:

    • Ensure that the supply voltage (Vcc) is within the specified range of 1.8 V ± 0.1 V.
    • Use a stable power supply to avoid voltage fluctuations that could damage the device.
  2. Interface Configuration:

    • Connect the device using the Toggle Mode 2.0 interface for optimal performance.
    • Ensure that the data lines are properly terminated to minimize signal reflections and improve data integrity.
  3. Temperature Management:

    • Operate the device within the temperature range of -40°C to +85°C for normal operation.
    • Store the device within the temperature range of -55°C to +125°C to ensure long-term reliability.
  4. Programming and Erasing:

    • The device supports up to 3,000 program/erase cycles. Avoid excessive cycling to extend the lifespan of the memory.
    • Use appropriate error correction code (ECC) algorithms to correct bit errors and maintain data integrity. The device requires up to 24 bits of ECC per 512 bytes of data.
  5. Data Retention:

    • The device retains data for up to 10 years at 25°C. For longer storage periods or higher temperatures, consider periodic refresh operations to maintain data integrity.
  6. Handling and Storage:

    • Handle the device with care to avoid physical damage.
    • Store the device in a dry, cool environment to prevent moisture damage.
  7. Soldering:

    • Follow recommended soldering profiles to avoid thermal stress that could damage the device.
    • Use a reflow oven with a controlled temperature profile to ensure uniform heating and cooling.
  8. Testing:

    • Perform initial testing to verify the functionality of the device.
    • Regularly test the device during operation to ensure continued performance and reliability.
(For reference only)

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