CD4044BM: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	V_DD	3.0	-	18.0	V
Input Voltage (High)	V_IH	-	-	V_DD - 1.5	V
Input Voltage (Low)	V_IL	0	-	V_DD - 3.5	V
Output Voltage (High)	V_OH	V_DD - 1.5	-	V_DD	V	I_O = -1.0 mA
Output Voltage (Low)	V_OL	0	-	0.5	V	I_O = 1.0 mA
Propagation Delay Time	t_pd	-	36	-	ns	V_DD = 10V, f = 1 MHz
Power Dissipation	P_D	-	-	500	mW
Operating Temperature	T_A	-40	-	85	°C
Storage Temperature	T_STG	-65	-	150	°C

Supply Voltage:
- Ensure the supply voltage (V_DD) is within the range of 3.0V to 18.0V.
- Avoid exceeding the maximum supply voltage to prevent damage to the device.
Input Voltages:
- For a high input, the voltage should be at least V_DD - 1.5V.
- For a low input, the voltage should be no more than V_DD - 3.5V.
Output Voltages:
- When sourcing current (I_O = 1.0 mA), the output voltage (V_OL) should not exceed 0.5V.
- When sinking current (I_O = -1.0 mA), the output voltage (V_OH) should be at least V_DD - 1.5V.
Propagation Delay:
- The typical propagation delay time (t_pd) is 36 ns at V_DD = 10V and f = 1 MHz.
Power Dissipation:
- The maximum power dissipation (P_D) is 500 mW. Ensure proper heat dissipation if operating near this limit.
Temperature Ranges:
- The operating temperature range (T_A) is from -40°C to 85°C.
- The storage temperature range (T_STG) is from -65°C to 150°C.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Use appropriate ESD protection measures during handling and installation.
Mounting:
- Ensure the device is properly mounted on a PCB with adequate clearance and thermal management if necessary.
- Follow the recommended soldering profile to avoid thermal stress.
Testing:
- Before final assembly, test the device under specified conditions to ensure it meets the required performance parameters.

(For reference only)