Penerangan
LED Die Bonder - DB156
Features:
- Compatible with a wide range of package types.
- Lateral CCD monitoring for precise dispensing control.
- Customised optical communication TO-can die bonding function.
- Flexible configuration to meet customised functional requirements.
Specifications:
- Wafer Ring Size: 6”
- Chip Size: 6–40 mil
- Placement Accuracy: ±38 μm (X, Y), ±3° (θ)
- Work Table Size: 230 × 120 m
Lebih maklumat tentang Infidawn (M) Sdn Bhd
Malaysia
